COMPONENT PLACEMENT PROCESS AND APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120218402A1
SERIAL NO

13033789

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pick and place machine is described which uses an imprint left in a layer of fluid by a component that has been dipped in the fluid to guide a placement process. An apparatus for placing a component is disclosed, which includes a surface that receives a layer of fluid, an imprint of a component in the layer of fluid, and a camera that captures an image of the imprint in the fluid. A method of placing a component with a pick and place machine is disclosed which includes dipping a component in a layer of fluid, capturing an image of the layer of fluid, analyzing the image of the layer of fluid, and placing the component based on results of the analysis of the image of the layer of fluid. The image can be used to determine the status of the component or where to place the component.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSAL INSTRUMENTS CORPORATION33 BROOME CORPORATE PARKWAY CONKLIN NY 13748

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gieskes, Koenraad A Deposit, US 8 117
Vinson, Michael R Vestal, US 2 42
Yingling, Michael Binghamton, US 1 6

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