Wavelength-division multiplexing for use in multi-chip systems
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United States of America Patent
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Jan 1, 2013
Grant Date -
Sep 13, 2012
app pub date -
Sep 28, 2007
filing date -
Sep 28, 2007
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Abstract
Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
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