POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION COMPRISING SAME
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United States of America Patent
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Issued Date -
Sep 13, 2012
app pub date -
Dec 6, 2010
filing date -
Dec 14, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1):
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