Low-Profile Heat Sink with Fine-Structure Patterned Fins for Increased Heat Transfer
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United States of America Patent
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Issued Date -
Sep 20, 2012
app pub date -
Mar 16, 2011
filing date -
Mar 16, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one embodiment, a device for transferring heat comprises a base member and a first array of pin fins supported by the base member, the pin fins having an aspect ratio of not less than about 10, and the pin fins being not more than about 0.3 mm in equivalent diameter and not more than about 3 mm in length, either one or both of the base member and pin fins comprising a metallic or semiconductor material. To form this device, a substrate is provided. A pattern is formed on the substrate, the pattern having holes therein or in the form of dots with cross-sectional dimensions of not more than about 0.3 mm. Pin fins supported by the substrate are formed, where the pin fins have an aspect ratio of not less than about 10, and not more than about 0.3 mm in equivalent diameter and not more than about 3 mm in length. Either one or both of the base member and pin fins comprise a metallic or semiconductor material. The pattern is then removed.
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