Light-Emitting Diode Module and Corresponding Manufacturing Method
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United States of America Patent
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Issued Date -
Sep 20, 2012
app pub date -
Jun 16, 2010
filing date -
Nov 13, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A new manufacturing method is described by the present invention for a new LED module 1. The method comprises mounting of at least one LED 3 onto a surface of a substrate 2, and depositing a base layer 5 to cover said substrate 2 surface and the LED 3, wherein the base layer 5 is transparent for visible light and preferably does not comprise phosphor particles. Optionally, a first heat treatment to modify the surface properties of the base layer 5 is comprised. The method further comprises dispensing a matrix material, so that it forms an essentially half-spherical cover covering the LED and optionally nearby portions of the base layer, and optionally, a second heat treatment to harden the half-spherical cover layer. Additionally the present invention discloses an LED module 1, which is manufactured by the claimed method.
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