THIN FILM THROUGH-GLASS VIA AND METHODS FOR FORMING SAME
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United States of America Patent
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Issued Date -
Sep 20, 2012
app pub date -
Mar 15, 2011
filing date -
Mar 15, 2011
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Abandoned
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Abstract
This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.
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Patent Owner(s)
Patent Owner | Address | |
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SNAPTRACK INC | 5775 MOREHOUSE DRIVE SAN DIEGO CA 92121 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Burns, David William | San Jose, US | 89 | 3577 |
Shenoy, Ravindra Vaman | San Jose, US | 53 | 1096 |
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