Creation of very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices and methods for forming the same
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Mar 21, 2012
filing date -
Mar 22, 2011
priority date (Note) -
Abandoned
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Abstract
Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. A general method for the formation of thin films of some particular dielectric material is disclosed, wherein the use of organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Additionally, methods whereby the formation of certain transition metal salts as salt or oxide matrices at low temperatures utilizing mild reducing agents are disclosed. Further, a method for the enhancement of dielectric permittivity formation in the dielectric material of the capacitor is taught.
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