INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Mar 23, 2011
filing date -
Mar 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an integrated circuit adjacent the lead; molding an encapsulation encapsulating the lead and the integrated circuit; and forming a leveling standoff protruded from the same surface of the encapsulation as the lead with the integrated circuit between the lead and the leveling standoff electrically isolated from the lead and the integrated circuit.
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