MINIATURIZED ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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N/A
Issued Date -
Sep 27, 2012
app pub date -
Aug 11, 2011
filing date -
Mar 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A miniaturized electromagnetic interference (EMI) shielding structure is disclosed, which includes a substrate and a plurality of chip modules disposed thereon. The substrate has a plurality of ground portions formed thereon. Each chip module includes: at least one chip unit disposed on the substrate and connected electrically thereto; at least one conductive bump disposed on the substrate adjacent to the chip unit and connected electrically to the corresponding ground portion; an encapsulation layer arranged on the substrate and covers the chip unit and the conductive bump; and an EMI shielding layer covering the encapsulation layer and electrically connected with an exposed surface of the conductive bump, to allow the EMI shielding layer be electrically connected to the ground portion. The disclosure of the present invention allows each chip module to have its own EMI shielding capability.
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