METHOD FOR DEPOSITING A PALLADIUM LAYER SUITABLE FOR WIRE BONDING ON CONDUCTORS OF A PRINTED CIRCUIT BOARD, AND PALLADIUM BATH FOR USE IN SAID METHOD
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United States of America Patent
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Issued Date -
Sep 27, 2012
app pub date -
Nov 6, 2010
filing date -
Nov 10, 2009
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Abandoned
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Abstract
A method for generating a surface that can be bonded with gold wire. The surface is obtained by first depositing an exchange palladium layer made of the electrolyte on conductors of printed circuit boards, in particular on conductors made of copper or conductive paste. The exchange palladium layer is then reinforced with a palladium layer, deposited from a chemical palladium electrolyte. In order to protect the palladium, an exchange gold layer is then applied. An exchange palladium bath is used, comprising an organic brightener.
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