Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair
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United States of America Patent
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Issued Date -
Oct 4, 2012
app pub date -
Mar 28, 2012
filing date -
Mar 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Systems and methods for the ultrasonic cleaving of bonded wafer pairs are described. The system includes a tank for containing a volume of liquid, a wafer boat having a recess formed therein for receiving the bonded wafer pair. The recess has a pair of opposing, spaced-apart sidewalls disposed at an angle from a vertical axis. An ultrasonic agitator is configured to ultrasonically agitate the volume of liquid. The ultrasonic agitation of the volume of liquid results in the cleaving of the bonded wafer pair.
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