ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE FOR INTEGRATED CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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N/A
Issued Date -
Oct 4, 2012
app pub date -
May 3, 2011
filing date -
Mar 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electromagnetic interference (EMI) shielding structure for integrated circuit (IC) substrate includes a plurality of conductive contacts, a covering layer, and a sputtered layer. The conductive contacts are formed at the perimeter of a chip area on the IC substrate. The covering layer is formed on the conductive contacts and covers the chip area. A groove is formed on the covering layer for exposing the conductive contacts. The sputtered layer is formed on the covering layer and connected to the conductive contacts. The EMI shielding structure can restrain the interference in the chip area.
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