SENSOR PACKAGE HAVING INTEGRATED ACCELEROMETER AND MAGNETOMETER
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United States of America Patent
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Issued Date -
Oct 11, 2012
app pub date -
Apr 9, 2012
filing date -
Apr 8, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sensor package has integrated magnetic and acceleration sensor package structures, where a first wafer is bonded to a second wafer with a cavity defined between them. The magnetic sensor is bonded to the bottom of the first wafer and the acceleration sensor is provided within the cavity. Circuitry to drive the accelerometer and interface with the magnetic sensor is provided on the first wafer.
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