DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD
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United States of America Patent
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app pub date -
Apr 20, 2012
filing date -
Oct 23, 2009
priority date (Note) -
Abandoned
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Abstract
Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.
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