Thermal storage medium composition and thermal storage medium
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United States of America Patent
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Dec 31, 2013
Grant Date -
Oct 18, 2012
app pub date -
Dec 24, 2010
filing date -
Dec 25, 2009
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Abstract
Provided is a thermal storage medium composition which contains 100 parts by mass of a hydrogenated diene copolymer and 50 to 4000 parts by mass of a linear paraffin compound having 12 to 50 carbon atoms, where the hydrogenated diene copolymer is a conjugated diene copolymer that is obtained by hydrogenating a block copolymer which includes a polymer block (A) that contains structural units (a-1) derived from a first conjugated diene compound and has a vinyl bond content of not more than 20 mol %, and a polymer block (B) that contains structural units (b-1) derived from a second conjugated diene compound and has a vinyl bond content of 30 to 95 mol %, the hydrogenation ratio with respect to the double bonds derived from the conjugated diene compounds being not less than 90%.
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