SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS
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United States of America Patent
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Issued Date -
Oct 18, 2012
app pub date -
Apr 13, 2011
filing date -
Apr 13, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The packages include a plurality of spaced conductive standoffs electrically coupling the semiconductor die to, variously, a substrate and bottom package contacts. The conductive standoffs may be pillars or posts. The substrate includes at least one electrically isolated portion, which has exposed sidewalls.
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