STACKED-SUBSTRATE STRUCTURE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 25, 2012
app pub date -
Jun 2, 2011
filing date -
Apr 20, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The stacked-substrate structure includes a first substrate having a first die embedded therein, a second substrate having a second die embedded therein, a plurality of soldering elements, and a third die. The soldering elements are disposed between the first and the second substrates and connected to the first and the second substrates. The first and the second substrates are electrically connected via the soldering elements. The first substrate, the second substrate, and the soldering elements define an accommodating space. The third die is arranged in the accommodating space and is connected to one surface of the first substrate. The third die is electrically connected to the first and the second dies via the first substrate. Thus, the thickness of the stacked-substrate structure can be reduced, and the first and the second dies of the stacked-substrate structure can be test separately in different platforms.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully