METHOD OF FORMING ENCAPSULATED SOLID ELECTROCHEMICAL COMPONENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Apr 23, 2012
filing date -
Apr 26, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of forming an encapsulated solid electrochemical component includes stacking a first separator, a solid electrochemical component, and a second separator on an upper surface of a vacuum plate to form an electrochemical component assembly, applying a vacuum to the electrochemical component assembly, and applying a first laser beam around at least part of a circumference of the solid electrochemical component in the electrochemical component assembly while applying the vacuum to melt and bond the first and second separators together. The method also includes applying a second laser beam around the circumference of the solid electrochemical component in the electrochemical component assembly while applying the vacuum. The second laser beam has a second relatively high power compared to the power of the first laser beam such that the first and second separators around the circumference of the solid electrochemical component are cut.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully