Method and Device for Treating Silicon Substrates
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United States of America Patent
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Issued Date -
Nov 1, 2012
app pub date -
Dec 23, 2010
filing date -
Dec 23, 2009
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Abandoned
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Abstract
In a method for processing monocrystalline silicon wafers, which are transported while lying flat along a horizontal transport path, etching solution for texturing the surface is applied from above by means of nozzles or the like. The etching solution is applied from above several times in succession onto the upper side of the silicon substrates, remains there and reacts with the silicon substrate.
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