Shielding of Interior Diode Assemblies from Compression Forces in Thin-Film Photovoltaic Modules
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United States of America Patent
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app pub date -
Sep 2, 2011
filing date -
Dec 22, 2009
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Abandoned
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Abstract
A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive and tensile forces by providing at least one interior shielding element are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized shielding element may be used to shield the diode assembly.
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