MATERIAL FOR A MOLDED RESIN FOR USE IN A SEMICONDUCTOR LIGHT-EMITTING DEVICE
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United States of America Patent
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app pub date -
Jun 21, 2012
filing date -
Dec 22, 2009
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Abstract
The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b); (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 μm or more and 2.0 μm or less.
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