OXIDE THIN FILM TRANSISTOR RESISTANT TO LIGHT AND BIAS STRESS, AND A METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20120286271A1
SERIAL NO

13467674

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Abstract

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Disclosed are an oxide thin film transistor resistant to light and bias stress, and a method of manufacturing the same. The method includes forming a gate electrode on a substrate; forming a gate insulating layer on an upper part including the gate electrode; forming a source electrode and a drain electrode on the insulating layer; forming an active layer insulated from the gate electrode by the gate insulating layer and formed of an oxide semiconductor and a diffusion barrier film; and forming a protective layer on a portion of the source electrode and drain electrode and the upper part including the active layer, wherein the diffusion barrier film reduces movement of holes and prevents ionized oxygen vacancies from being diffused.

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Patent Owner(s)

Patent OwnerAddress
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE218 GAJEONG-RO YUSEONG-GU DAEJEON 34129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Chi Sun Daejeon, KR 54 881
OH, Him Chan Seoul, KR 9 38
Park, Sang Hee Daejeon, KR 89 791
Ryu, Min Ki Seoul, KR 28 248

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