DEVICE AND PROCESS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES
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United States of America Patent
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N/A
Issued Date -
Nov 15, 2012
app pub date -
May 13, 2011
filing date -
May 13, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A spin chuck and a process of operating the same display improved resistance to backsplash by provision of a media collecting ring mounted on the spin chuck. The media collecting ring surrounds a wafer to be processed and includes a radially-inwardly extending upper portion having an obliquely-angled downwardly-facing surface positioned above an upper surface of a wafer held in the device. The device moreover includes a stationary chamber surrounding the spin chuck equipped with at least two superposed collecting baffles. During treatment, liquid collected by the media collecting ring is preferably discharged radially outwardly through a series of holes formed in the ring, so as to pass between a pair of the superposed collecting baffles of the chamber.
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