SOLVENT VAPOR BONDING AND SURFACE TREATMENT METHODS
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United States of America Patent
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Issued Date -
Nov 15, 2012
app pub date -
May 12, 2011
filing date -
May 12, 2011
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a method of producing a microstructured device, as well as a method of processing a microstructured substrate to heal surface defects therein, a method of bonding substrates and healing surface defects in a substrate, and microstructured devices produced by these methods.
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