Method for producing semiconductor wafer
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United States of America Patent
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Jan 28, 2014
Grant Date -
Nov 22, 2012
app pub date -
Jan 14, 2011
filing date -
Jan 20, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A method of producing a semiconductor wafer, which includes: placing a wafer (10) provided with a substrate (11) and a semiconductor layer (20) formed thereon, on a carrier plate (fixing plate) (31) of a grinder via fixing wax (33a and 33b) such that the surface (10a) to be ground faces upward; heating the carrier plate to soften the fixing wax; pressure-contacting the wafer from the side of the surface (10a) to be ground using an air bag such that a portion of the softened fixing wax spreads and protrudes from the peripheral edge of the wafer; cooling the carrier plate while applying pressure to cure the fixing wax and fix the wafer onto the carrier plate; and rotating the surface (10a) to be ground of the fixed wafer while pressure-contacting the surface (10a) to the grinding plate of the grinder, thereby grinding the surface (10a) to be ground.
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