METHOD FOR RECLAIMING SEMICONDUCTOR WAFER AND POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
Nov 22, 2012
app pub date -
Jan 21, 2011
filing date -
Jan 29, 2010
priority date (Note) -
Abandoned
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Abstract
Provided is a polishing composition used for polishing a semiconductor wafer surface having a step in order to planarize the wafer surface and thereby reclaiming the semiconductor wafer. The polishing composition contains at least a step eliminating agent, which is adsorbed to the surface of the semiconductor wafer and acts to prevent etching of bottom portion of the step on the wafer surface during polishing. The step eliminating agent is, for example, a water-soluble polymer or a surfactant, and more specifically, a polyvinyl alcohol, a polyvinyl pyrrolidone, a polyethylene glycol, a cellulose, a carboxylic acid surfactant, a sulfonic acid surfactant, a phosphate ester surfactant, or an oxyalkylene polymer.
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