CONNECTION STRUCTURE OF PRINTED CIRCUIT BOARD, METHOD FOR PRODUCING SAME, AND ANISOTROPIC CONDUCTIVE ADHESIVE
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United States of America Patent
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N/A
Issued Date -
Nov 29, 2012
app pub date -
Sep 2, 2010
filing date -
Dec 2, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
There are provided a connection structure of printed circuit boards, and so forth, the connection structure including a first printed circuit board, a second printed circuit board located above the first printed circuit board, and an anisotropic conductive adhesive configured to establish a conductive connection between a conductor of the first printed circuit board and a conductor of the second printed circuit board, in which the anisotropic conductive adhesive contains a conductive filler, and in which the conductive filler is formed of crystallized metal-particle wires produced by allowing metal particles to crystallize and grow linearly. It is thus possible to easily achieve sufficiently high connection strength while a flying lead of one printed circuit board is electrically connected to a conductive lead (substrate pad) of the other printed circuit board.
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