METHOD FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Nov 29, 2012
app pub date -
Sep 22, 2011
filing date -
May 25, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for forming a flexible printed circuit board is provided. First, an insulating substrate with a first side and a second side is provided. Second, a through hole connecting the first side and the second side is formed in the insulating substrate. Then, a printing step is carried out to print a conductive precursor which is on the first side and cover and fill the through hole. Later, the conductive precursor is cured to form a conductive composition and to simultaneously form a circuit to obtain a flexible printed circuit board. The conductive composition includes at least one of carbon and silver.
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