REDUCING CROSSTALK BETWEEN MULTIPLE INTERCONNECTS
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United States of America Patent
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Issued Date -
Dec 6, 2012
app pub date -
Jun 5, 2012
filing date -
Jun 5, 2011
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Abandoned
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Abstract
Embodiments reduce crosstalk between multiple interconnects in a printed circuit board environment. Further, embodiments perform frequency-dependent modal decomposition of characteristics of two or more interconnects spanning one or more integrated circuits on an interconnect substrate. In addition, each interconnect includes one or more cascaded coupled traces, where the cascaded coupled traces have one or more discontinuities in a heterogeneous medium.
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