Method and device for detecting cracks in semiconductor substrates

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United States of America Patent

PATENT NO 9157869
APP PUB NO 20120307236A1
SERIAL NO

13504289

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Abstract

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A method and an apparatus for detecting cracks in semiconductor substrates, such as silicon wafers and solar cells, are provided. The method and apparatus are based on the detection of light deflected at a crack.

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Patent Owner(s)

Patent OwnerAddress
SCHOTT AG55122 MAINZ

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gerstner, Klaus Bischofsheim, DE 11 144
Ortner, Andreas Gau-Algesheim, DE 63 253
Stelzl, Michael Mainz, DE 6 30
Von, Campe Hilmar Bad Homburg, DE 20 198

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