RESIST REMOVAL APPARATUS AND RESIST REMOVAL METHOD

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United States of America Patent

SERIAL NO

13594412

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Abstract

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A resist removal apparatus and method are effective in removing a resist without oxidizing the substrate material other than the resist. The resist removal apparatus, which removes resist from a wafer on which a resist film has been formed, includes a cluster spraying unit which sprays a wafer with clusters each of which is formed of a plurality of organic solvent molecules agglomerated together.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325
IWATANI CORPORATIONOSAKA 541-0053

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DOBASHI, Kazuya Nirasaki City, JP 42 1046
FUSE, Takashi Fremont, US 42 207

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