PACKAGED DEVICE INCLUDING INTERPOSER FOR INCREASED ADHESIVE THICKNESS AND METHOD OF ATTACHING DIE TO SUBSTRATE
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United States of America Patent
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Issued Date -
Dec 13, 2012
app pub date -
Jun 9, 2011
filing date -
Jun 9, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A device includes a die having: at least one of an electronic device and a microelectromechanical system, a package substrate, an electrically nonconductive interposer disposed between the die and the package substrate, at least a first adhesive layer disposed between the package substrate and the electrically nonconductive interposer, and at least a second adhesive layer disposed between the die and the electrically nonconductive interposer.
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