PACKAGE CARRIER AND PACKAGE STRUCTURE
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United States of America Patent
Stats
-
N/A
Issued Date -
Dec 13, 2012
app pub date -
Oct 27, 2011
filing date -
Jun 13, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package carrier includes: a carrier having a main mounting surface and at least two side mounting surfaces connecting the main mounting surface; a dielectric layer disposed on the carrier, having multiple first openings and extending from the main mounting surface up, along boundaries between the main mounting surface and the side mounting surfaces, onto the side mounting surfaces, in which the first openings expose a portion of the main mounting surface and portions of the side mounting surfaces; a metal layer disposed on the dielectric layer and having multiple second openings disposed correspondingly to the first openings and multiple third openings exposing the partial dielectric layer at the above-mentioned boundaries; a surface treatment layer disposed on the partial metal layer; and a solder resist layer disposed on a portion of the metal layer and a portion of the dielectric layer both exposed out of the surface treatment layer.
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