Importance

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Abstract

Condensation adhesives are applied via a contactless system and method to a wood substrate, such as laminate beams. The adhesive is modified and applied in particular to a finger surface of a substrate via a contactless application device. The contactless application device has at least 2 nozzles for ejecting adhesive onto the substrate without contacting the substrate. The modified adhesive includes a condensation resin selected from the group of urea formaldehyde (UF) resin, melamine formaldehyde resin (MF), modified melamine formaldehyde resin (xMF) and phenol resorcinol formaldehyde resin (PRF) or combinations thereof, and optionally a hardener. The adhesive rheology is modified by at least one of: cooling to a temperature between 5 and 15° C., including into the adhesive a viscosity increasing substance, and/or including a thixotropic increasing substance in an effective amount to prevent sagging of the adhesive on the surface.

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First Claim