APPARATUS FOR THERMAL AND PLASMA ENHANCED VAPOR DEPOSITION AND METHOD OF OPERATING
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United States of America Patent
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app pub date -
Aug 1, 2012
filing date -
Nov 18, 2005
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Abstract
A method for vapor deposition on a substrate in a vapor deposition system having a process space separated from a transfer space. The method disposes a substrate in a process space of a processing system that is vacuum isolated from a transfer space of the processing system, processes the substrate at either of a first position or a second position in the process space while maintaining vacuum isolation from the transfer space by way of a movement accommodating sealing material, and deposits a material on the substrate at either the first position or the second position.
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