METHOD OF CLEANING WAFER SURFACES AFTER POLISHING ALUMINUM WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS
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United States of America Patent
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Aug 29, 2012
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Jul 21, 2010
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Abstract
A method of cleaning wafer surfaces after polishing aluminum wirings by means of a polishing disc in ultra large scale integrated circuits, the method including: a) mixing and stirring deionized water, between 0.5 and 5 wt. % of a surfactant, between 0.1 and 5 wt. % of an FA/O II chelating agent, and between 0.01 and 5 wt. % of an FA/O II corrosion inhibitor, to yield a neutral aqueous cleaning solution; and b) after a chemical-mechanical polishing treatment for aluminum wirings, directly washing wafer surfaces with the neutral aqueous cleaning solution without lifting the polishing disc.
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