HEATER BLOCK FOR WIRE BONDING SYSTEM
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United States of America Patent
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app pub date -
Jun 15, 2011
filing date -
Jun 15, 2011
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Abstract
A heater block for a wire bonding system includes a mounting base configured to receive a lead frame and a semiconductor die mounted on the lead frame. A heating structure is removably coupled to a top surface of the mounting base. The heating structure includes a central heating surface and side heating panels surrounding the central heating surface. The heating structure selectively heats wire bonding areas of the lead frame.
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