VARIABLE-THICKNESS ELECRIPLAST MOLDABLE CAPSULE AND METHOD OF MANUFACTURE
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United States of America Patent
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Issued Date -
Dec 20, 2012
app pub date -
Aug 10, 2012
filing date -
Feb 15, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.
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