ELECTROPLATED LEAD-FREE BUMP DEPOSITION
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United States of America Patent
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app pub date -
Dec 17, 2010
filing date -
Dec 17, 2010
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Abstract
A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.
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