INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Jun 22, 2011
filing date -
Jun 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting an organic chip assembly on the base substrate, the organic chip assembly includes providing an assembly integrated circuit embedded in an organic cover, the organic cover having a through via, and the organic chip assembly having a vertical assembly side; forming a molded underfill encapsulating the vertical assembly side, and between the organic chip assembly and the base substrate; and removing a portion of the organic chip assembly and the molded underfill for forming a planarized assembly surface.
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