Systems and Methods for Extending Operating Temperatures of Electronic Components
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United States of America Patent
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Issued Date -
Jan 3, 2013
app pub date -
Jun 30, 2011
filing date -
Jun 30, 2011
priority date (Note) -
Abandoned
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Abstract
According to various embodiments, an electronic component, such as a processor, is thermally coupled to a heat sink via a heat pipe. The heat pipe may contain a working fluid configured to freeze below a threshold temperature corresponding to the minimum operating temperature of the electronic component. Accordingly, if the temperature of the electronic component and/or the working fluid is below the threshold temperature, then the working fluid freezes, decreasing the amount of thermal energy transferred from the electronic component to the heat sink. The electronic component may self-heat until it is at least above the threshold temperature. Above the threshold temperature, the working fluid is in a fluid phase and increases the amount of thermal energy transferred from the electronic component to the heat sink via the heat pipe, and thereby reducing the temperature of the electronic component.
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