ELECTROSTATIC CHUCKS, SUBSTRATE TREATING APPARATUSES INCLUDING THE SAME, AND SUBSTRATE TREATING METHODS
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United States of America Patent
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Issued Date -
Jan 3, 2013
app pub date -
Jun 27, 2012
filing date -
Jun 30, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided is an electrostatic chuck for fixing a substrate by using an electrostatic force, which include a dielectric plate on which the substrate is placed, a first electrode disposed in an inner center region of the dielectric plate, and charged negatively or positively, and a second electrode disposed in an inner edge region of the dielectric plate to surround the first electrode, and charged with polarity opposite to that of the first electrode. The second electrode has an area different from that of the first electrode.
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