Cardboard-Box-Free Packaging Of Solid Yeast Products
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United States of America Patent
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app pub date -
Jun 13, 2012
filing date -
Dec 14, 2009
priority date (Note) -
Abandoned
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Abstract
The invention relates to packaging (10) for solid yeast products, such as: a supporting element (12); solid yeast products contained in one or more packages (22), supported by the supporting element (12); and an outer cover (14) retaining all of the solid yeast products contained in the packages (22) on the supporting element (12). According to the invention, all of the packages (22) located between the solid yeast products and the outer cover (14) may have a surface density no greater than 200 g/m2. The invention also relates to a method for packaging solid yeast products and to a method for preserving and using solid yeast products thus packaged.
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