UNIFORM LARGE-GRAINED AND GRAIN BOUNDARY LOCATION MANIPULATED POLYCRYSTALLINE THIN FILM SEMICONDUCTORS FORMED USING SEQUENTIAL LATERAL SOLIDIFICATION AND DEVICES FORMED THEREON
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United States of America Patent
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app pub date -
Aug 28, 2012
filing date -
May 28, 1996
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Abstract
Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed. One method includes generating a sequence of excimer laser pulses, controllably modulating each pulse to a predetermined fluence, homoginizing each modulated pulse in a predetermined plane, masking portions of each homoginized pulse with a pattern of slits to generate a sequence of fluence controlled pulses of line patterned beamlets, each slit in the pattern of slits being sufficiently narrow to prevent inducement of significant nucleation in region of a silicon thin film sample irradiated by a beamlet corresponding to the slit, irradiating an amorphous silicon thin film sample with the sequence of fluence controlled slit patterned beamlets to effect melting of portions corresponding to each fluence controlled patterned beamlet pulse, and controllably sequentially translating a relative position of the sample with respect to each of the fluence controlled pulse of slit patterned beamlets.
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