Method for producing semiconductor optical integrated device

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United States of America Patent

PATENT NO 8637329
APP PUB NO 20130012002A1
SERIAL NO

13537221

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Abstract

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A method for producing a semiconductor optical integrated device includes the steps of forming a substrate product including first and second stacked semiconductor layer portions; forming a first mask on the first and second stacked semiconductor layer portions, the first mask including a stripe-shaped first pattern region and a second pattern region, the second pattern region including a first end edge; forming a stripe-shaped mesa structure; removing the second pattern region of the first mask; forming a second mask on the second stacked semiconductor layer portion; and selectively growing a buried semiconductor layer with the first and second masks. The second mask includes a second end edge separated from the first end edge of the first mask, the second end edge being located on the side of the second stacked semiconductor layer portion in the predetermined direction with respect to the first end edge of the first mask.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDJAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiratsuka, Kenji Yokohama, JP 27 109
Kobayashi, Hirohiko Yokohama, JP 41 467
Koyama, Kenji Yokohama, JP 57 689
Yanagisawa, Masaki Yokohama, JP 52 4089
Yoneda, Yoshihiro Yokohama, JP 165 1518

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