Heat-resistant structural wood adhesive compositions involving pMDI, polyol and aromatic polyols
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United States of America Patent
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Mar 10, 2015
Grant Date -
Jan 10, 2013
app pub date -
Mar 10, 2011
filing date -
Mar 16, 2010
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Abstract
This invention describes an adhesive composition that forms the basis of a heat-resistant, fire resistant, and water resistant polyurethane adhesive suitable for applications in the manufacture of wood products, and the method of making the adhesive. The wood finger-jointed studs produced using an adhesive derived from this invention can meet or exceed the fire rating of a period of 60 minutes according to ASTM E 119 and ASTM D 7374. The heat resistance of the adhesive is a result of incorporating thermally stable aromatic polyol molecules into the polymeric structures of the wood adhesive system, which is composed of the reaction products of a poly(methylene diphenyl diisocyanate), at least one of a polyether polyol and a polyester polyol; and the aromatic polyol that is a hydroxyl phenol in a preferred embodiment. Furthermore, this novel wood adhesive system possesses high water-resistance, making it suitable for the manufacture of highly durable engineered wood products. It is fast moisture-curable at ambient temperatures. It is also formaldehyde-free.
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