SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Jan 24, 2013
app pub date -
Apr 12, 2011
filing date -
Apr 14, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.
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