Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer
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United States of America Patent
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Sep 15, 2015
Grant Date -
Jan 24, 2013
app pub date -
Apr 12, 2011
filing date -
Apr 14, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.
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