SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Jan 24, 2013
app pub date -
Jul 3, 2012
filing date -
Jul 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Semiconductor devices are provided. The semiconductor device includes conductive patterns vertically stacked on a substrate to be spaced apart from each other, and pad patterns electrically connected to respective ones of the conductive patterns. Each of the pad patterns includes a flat portion extending from an end of the conductive pattern in a first direction parallel with the substrate and a landing sidewall portion upwardly extending from an end of the flat portion. A width of a portion of the landing sidewall portion in a second direction parallel with the substrate and perpendicular to the first direction is less than a width of the flat portion in the second direction. The related methods are also provided.
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