HIGH DENSITY IMPLANTABLE CONNECTOR

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130023973A1
SERIAL NO

13631267

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An implantable connector assembly comprising a first portion having a longitudinal body which includes a transversal protrusion having therein at least one conductive socket, a generally longitudinal wire entry, at least one wire connected to the at least one conductive socket, the at least one wire entering the longitudinal body through the generally longitudinal wire entry, a second portion having a longitudinal body which includes a recess complementary to the transversal protrusion of the first portion, generally longitudinal wire entry, at least one conductive pin positioned within the recess, at least one wire connected to the at least one conductive pin, the at least one wire connected to the conducting pin entering the longitudinal body through the longitudinal wire entry and a sealing assembly. Wherein, in a connected configuration, the transversal protrusion engages the recess causing the at least one conductive pin to enter in contact with the at least one conductive socket, the sealing assembly being positioned between the transversal protrusion and the complementary recess to protect the at least one conductive pin and the at least one conductive socket from liquid infiltration.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
NEUROSTREAM TECHNOLOGIES GENERAL PARTNERSHIPQUEBEC CANADA QUEBEC

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boiteau, Pierre-Etienne Quebec, CA 1 17
Neurostream, Technologies General Partnership null Quebec, CA 1 17
Richard, Martin Montreal, CA 18 267

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